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KMID : 0362419950330010001
Journal of Korean Academy of Prosthodontics
1995 Volume.33 No. 1 p.1 ~ p.12
The effect of time delay after silicoatingon the bond strength between the metal and resin cement
Yang Jin-Kyoung

Bae Jeong-Sik
Abstract
For the purpose of this study, the silicoating on Ni-Cr-Be alloy surface was carried out by using the Silicoater MD. The effect of time delay after silicoating on the bond strength between the metal and resin cement was examined. The groups were divided into 4 : group 1 : Sandblasted with 250§­ aluminium oxide, immediately cemented group 2: Sandblasted with 250§­ aluminium oxide, silicoated and immediately cemented group3: Sandblasted with 250§­aluminium oxide, silicoated and cemented after 7 days group 4: Sandblasted with 250§­ aluminium oxide, silicoated and coated with unfilled resin and cemented after 7 days Specimens were luted with Comspan, Superbond C&B or Panavia Ex. The tensile bond strength between the metal and resin cement was measured by using the universal testing machine. @ES The results were as follows: @EN 1. The bond strength in groups 2, 3 and 4 was higher than that of group 1 (p<0.05). There was no statistically significant difference among the bond strength in groups 2, 3 and 4 (p>0.05). 2. In Comspan-cemented groups, there was no significant difference among the bond strength in groups 2, 3 and 4 (p>0.05). 3. In Panavia EX-cemented groups, the bond strength of group 3 was higher than that of group 2 (p>0.05) and there was no significant difference between groups 3 and 4. 4. In Superbond C&B-cemented groups, there was significant difference between groups 2 and 3 (p<0.05) and the bond strength of group 4 was higher than that of group 3 (p<0.05) 5. The highest tensile bond strength was obtained by using the Superbond C&B and no difference in the Panavia EX and Comspan. 6. The modes of bond failure were mainly cohesive failure. The method of storage and transport indicated in this study seems recommendable for laboratory and clinical use at least up to 7 days.
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